MicroPack3D
We are offering adaptive electronic packaging which is the housing and connecting of integrated circuits.
Company Description:
We are offering adaptive electronic packaging which is the housing and connecting of integrated circuits. Whenever it comes to demands from the market for small lot sizes (several hundred or thousands), or quickly manufactured packages, our technology offers just the right advantage. Our aim at Micropack3D is enabling new generations of highly adapted and specialized electronics and shortening precious development time.Video Pitch:
Country
GermanyYear Founded
2020Company Phase
Development & Production PhasePlease specify in what phase you are!
We have found a few months ago and are selling to our first customer on a regular basis. We have developed a special package that is sold within a frame agreement. We are also within the last steps of our Seed Financing round and hope to close it at the beginning of next year.Number of employees
1-5Existing Sponsors & Partners
We are partnering with our pilot customer and are starting development with big semiconductor manufacturers. We are also partnering with companies to further develop our process.Did you get funding?
Yes, Governmental & OrganisationsInvestment needed?
No, already fundedMilestones
We were awarded an EXIST Forschungstransfer and won 2nd price at last years productronica Fast Forward as well as this year's Embedded WorldWebsite
www.micropack3d.comView all participants of the electronica Fast Forward 2020.
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